1. Thermal performance challenges from silicon to systems;Viswanath;Intel Technol. J., Q3,2000
2. Thermal interface materials;deSorgo;Electron. Cool.,1996
3. Fundamentals of Heat and Mass Transfer;Incropera,1996
4. Intel Corp., 2001. Intel® Pentium® 4 processor in the 423-pin package at 1.30, 1.40, 1.50, 1.60, 1.70, 1.80, 1.90 and 2GHz, #249198-005, August 2001.
5. Intel Corp., 2000. Intel® Pentium® 4 processor in the 423-pin package thermal solution functional specification, #249204-001 http://developer.intel.com/design/pentium4/datashts/249198.htm.