SPI-Modified h-BN Nanosheets-Based Thermal Interface Materials for Thermal Management Applications-Reference-Cited by-同舟云学术

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SPI-Modified h-BN Nanosheets-Based Thermal Interface Materials for Thermal Management Applications

Published:2024-06-19 Issue:26 Volume:16 Page:34367-34376
ISSN:1944-8244
Container-title:ACS Applied Materials & Interfaces
language:en
Short-container-title:ACS Appl. Mater. Interfaces

Author:

Ravichandran Vanmathi¹,Chandrashekar Akshatha²,Prabhu T. Niranjana²,Varrla Eswaraiah¹^ORCID

Affiliation:

1. Sustainable Nanomaterials and Technologies Lab, Department of Physics and Nanotechnology, SRM Institute of Science and Technology, Kattankulathur, Chengalpattu, Tamil Nadu 603203, India

2. Department of Chemistry, Faculty of Mathematical and Physical Sciences, M S Ramaiah University of Applied Sciences, Peenya Industrial Area, Bangalore, Karnataka 560058, India

Funder

Department of Science and Technology, Ministry of Science and Technology

SRM Institute of Science and Technology

Life Sciences Research Board

Publisher

American Chemical Society (ACS)

Link

https://pubs.acs.org/doi/pdf/10.1021/acsami.4c05332

Reference53 articles.

1. Largely enhanced thermal conductive, dielectric, mechanical and anti-dripping performance in polycarbonate/boron nitride composites with graphene nanoplatelet and carbon nanotube

2. Enhanced Thermal Conductivity of Epoxy Composites Filled with 2D Transition Metal Carbides (MXenes) with Ultralow Loading

3. Emerging challenges and materials for thermal management of electronics

4. Thermal Properties of the Binary‐Filler Hybrid Composites with Graphene and Copper Nanoparticles

5. Interfacial thermal resistance: Past, present, and future

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