A study on dielectric properties of a new polyimide film suitable for interlayer dielectric material in microelectronics applications-Reference-Cited by-同舟云学术

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A study on dielectric properties of a new polyimide film suitable for interlayer dielectric material in microelectronics applications

Published:2000-08 Issue:8 Volume:31 Page:629-634
ISSN:0026-2692
Container-title:Microelectronics Journal
language:en
Short-container-title:Microelectronics Journal

Author:

Kuntman A,Kuntman H

Publisher

Elsevier BV

Subject

General Engineering

Reference33 articles.

1. Polymer in Microelectronics Fundamentals and Application;Soone,1989

2. High Temperature Resistant Polymers;Frazer,1963

3. Polyimides;Wilson,1990

4. A.R.K. Ralston, M.C. Buncick, D.D. Denton, T.E. Boltshauser, J.M. Funk, H.P. Baltes, Effects of aging on polyimide. A model for dielectric behavior, IEEE, 91 CH 2817-5/91/0000-0759, 1991, pp. 759–763.

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