Optimized electrothermal design of integrated devices through the solution to the non-linear 3-D heat flow equation-Reference-Cited by-同舟云学术

Optimized electrothermal design of integrated devices through the solution to the non-linear 3-D heat flow equation

Published:2001-10 Issue:10-11 Volume:32 Page:823-831
ISSN:0026-2692
Container-title:Microelectronics Journal
language:en
Short-container-title:Microelectronics Journal

Author:

Pesare Marcello,Giorgio Agostino,Perri Anna Gina

Publisher

Elsevier BV

Subject

General Engineering

Reference19 articles.

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4. Thermal analysis of solid state devices using the boundary element method;Lee;IEEE Transactions on Electron Devices,1988

5. Thermal analysis of multiple-layer structures;Kokkas;IEEE Transactions on Electron Devices,1974

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1. A parametric dynamic compact thermal model of an electrothermally actuated micromirror;Journal of Micromechanics and Microengineering;2009-05-18

2. Reduced order thermal modeling of a one-dimensional electrothermally actuated micromirror device;SPIE Proceedings;2008-02-07

3. Dynamic electro-thermal simulation of microsystems—a review;Journal of Micromechanics and Microengineering;2005-10-17

4. Precise and simple DC-electrothermal characterization of MMIC power amplifiers;Ninteenth Annual IEEE Semiconductor Thermal Measurement and Management Symposium, 2003.