Intrinsic stress and stiffness variations in amorphous carbon
Author:
Publisher
Elsevier BV
Subject
Electrical and Electronic Engineering,Materials Chemistry,Mechanical Engineering,General Chemistry,Electronic, Optical and Magnetic Materials
Reference32 articles.
1. Tetrahedral bonding in amorphous carbon
2. Compressive-stress-induced formation of thin-film tetrahedral amorphous carbon
3. Deposition mechanisms for promoting sp3 bonding in diamond-like carbon
4. Highly tetrahedral amorphous carbon films with low stress
5. Thick stress-free amorphous-tetrahedral carbon films with hardness near that of diamond
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