Microstructure evolution and thermostability of bondline based on Cu@Sn core-shell structured microparticles under high-temperature conditions-Reference-Cited by-同舟云学术

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Microstructure evolution and thermostability of bondline based on Cu@Sn core-shell structured microparticles under high-temperature conditions

Published:2017-10 Issue: Volume:131 Page:196-203
ISSN:0264-1275
Container-title:Materials & Design
language:en
Short-container-title:Materials & Design

Author:

Hu Tianqi,Chen Hongtao^ORCID,Li Mingyu,Wang Chunqing

Funder

National Natural Science Foundation of China

Science and Technology Project of Shenzhen

Publisher

Elsevier BV

Subject

Mechanical Engineering,Mechanics of Materials,General Materials Science

Reference30 articles.

1. SiC–emerging power device technology for next-generation electrically powered environmentally friendly vehicles;Hamada;IEEE Trans. Electron Devices,2015

2. Reliability modeling of Sn–Ag transient liquid phase die-bonds for high-power SiC devices;Bajwa;Microelectron. Reliab.,2016

3. Future prospects of widebandgap (WBG) semiconductor power switching devices;Shenai;IEEE Trans. Electron Devices,2015

4. Survey of high-temperature reliability of power electronics packaging components;Khazaka;IEEE Trans. Power Electron.,2015

5. Au–Sn bonding material for the assembly of power integrated circuit module;Zhu;J. Alloys Compd.,2016

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