High resolution residual stress gradient characterization in W/TiN-stack on Si(100): Correlating in-plane stress and grain size distributions in W sublayer-Reference-Cited by-同舟云学术

High resolution residual stress gradient characterization in W/TiN-stack on Si(100): Correlating in-plane stress and grain size distributions in W sublayer

Published:2017-10 Issue: Volume:132 Page:72-78
ISSN:0264-1275
Container-title:Materials & Design
language:en
Short-container-title:Materials & Design

Author:

Hammer René,Todt Juraj,Keckes Jozef,Sartory Bernhard,Parteder Georg,Kraft Jochen,Defregger Stefan

Funder

Austrian Federal Government

Österreichische Forschungsförderungsgesellschaft

Publisher

Elsevier BV

Subject

Mechanical Engineering,Mechanics of Materials,General Materials Science

Reference48 articles.

1. Thin Film Materials: Stress, Defect Formation and Surface Evolution;Freund,2004

2. Stresses and Failure Modes in Thin Films and Multilayers, Lyngby: Notes for a Dcamm Course;Hutchinson,1996

3. Methods of measuring residual stresses in components;Rossini;Mater. Des.,2012

4. Annealing of intrinsic stresses in sputtered TiN films: the role of thickness-dependent gradients of point defect density;Köstenbauer;Surf. Coat. Technol.,2007

5. Influence of deposition conditions on texture development and mechanical properties of TiN coatings;Mayrhofer;Int. J. Mater. Res.,2009

Cited by 12 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Investigative characterization of delamination at TiW-Cu interface in low-temperature bonded interconnects;Materials Characterization;2024-03

2. Probing the composition dependence of residual stress distribution in tungsten-titanium nanocrystalline thin films;Communications Materials;2023-02-15

3. Correlations between Microstructure and Residual Stress of Nanoscale Depth Profiles for TSV-Cu/TiW/SiO2/Si Interfaces after Different Thermal Loading;Materials;2023-01-03

4. Selected Topics on Integrated Computational Material, Process, and Product Engineering;BHM Berg- und Hüttenmännische Monatshefte;2021-12-15

5. A New Approach for Residual Stress Analysis of GH3535 Alloy by Using Two-Dimensional Synchrotron X-Ray Diffraction;Chinese Physics Letters;2020-07-01