Decomposition and dewetting of super-saturated Cu-15 at. % Co solid solution film-Reference-Cited by-同舟云学术

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Decomposition and dewetting of super-saturated Cu-15 at. % Co solid solution film

Published:2024-05 Issue: Volume:241 Page:112892
ISSN:0264-1275
Container-title:Materials & Design
language:en
Short-container-title:Materials & Design

Author:

Farzam Farnaz^ORCID,Bellón Bárbara,Chatain Dominique^ORCID,Jiménez José A.,Breitbach Benjamin,Ghidelli Matteo^ORCID,Jazmin Duarte María,Dehm Gerhard^ORCID

Funder

European Research Council

Publisher

Elsevier BV

Reference42 articles.

1. Copper hillock induced copper diffusion and corrosion behavior in a dual damascene process;Kim;Electrochem. Solid St.,2007

2. Feasibility study on the use of Cu (Co) alloy for barrierless copper metallization;Fei;Thin Solid Films,2016

3. G. Dehm, T. J. Balk, H. Edongué, E. Arzt “Small-scale plasticity in thin Cu and Al films” Microelectronic Engineering, 70 (2-4) (2003), pp. 412-424.

4. R. P. Vinci, E. M. Zielinski, J. C. Bravman “Thermal strain and stress in copper thin films” Thin solid films, 262 (1-2) (1995), pp. 142-153.

5. Copper metallization reliability;Lloyd;Microelectron. Reliab.,1999

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