Author:
Zhou Xian-liang,Dong Ying-hu,Hua Xiao-zhen,Rafi-ud-din ,Ye Zhi-guo
Subject
Applied Mathematics,General Mathematics
Reference14 articles.
1. Fabrication of Mo/Cu multilayer and bilayer transition edge sensors;Ali;IEEE T Appl Supercond,2005
2. Fabrication and characterization of high dense Mo/Cu composites for electronic packaging applications;Chen;Trans Nonferr Metal Soc,2007
3. Powder metallurgy processing of Mo–Cu for thermal management applications;Johnson;Int J Powder Metall,1999
4. A three-dimensional TLM simulation method for thermal effect in high power insulated gate bipolar transistors;Hocine;Microelectron Eng,2003
5. Mo–Cu composites for electronic packaging applications;Kirk;Adv Powder Metall,1992
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