Interface design and the strengthening-ductility behavior of tetra-needle-like ZnO whisker reinforced Sn1.0Ag0.5Cu composite solders prepared with ultrasonic agitation-Reference-Cited by-同舟云学术

Interface design and the strengthening-ductility behavior of tetra-needle-like ZnO whisker reinforced Sn1.0Ag0.5Cu composite solders prepared with ultrasonic agitation

Published:2021-11 Issue: Volume:210 Page:110038
ISSN:0264-1275
Container-title:Materials & Design
language:en
Short-container-title:Materials & Design

Author:

Huo Fupeng^ORCID,Jin Zhi,Le Han Duy,Zhang Keke,Nishikawa Hiroshi

Funder

China Scholarship Council

Publisher

Elsevier BV

Subject

Mechanical Engineering,Mechanics of Materials,General Materials Science

Reference52 articles.

1. Tensile creep characteristics of Sn-3.5Ag-0.5Cu (SAC355) solder reinforced with nano-metric ZnO particles;Fawzy;Mater. Sci. Eng. A,2014

2. Effects of CeO2 nanoparticles addition on shear properties of low-silver Sn–0.3Ag–0.7Cu-xCeO2 solder alloys;Li;J. Alloys Compd.,2019

3. Microstructures and properties of new Sn-Ag-Cu lead-free solder reinforced with Ni-coated graphene nanosheets;Chen;J. Alloys Compd.,2016

4. Development of a Sn-Ag-Cu solder reinforced with Ni-coated carbon nanotubes;Han;J. Mater. Sci. Mater. Electron.,2011

5. Properties and microstructures of Sn-Ag-Cu-X lead-free solder joints in electronic packaging;Sun;Adv. Mater. Sci. Eng.,2015

Cited by 18 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Effect of ZnO nanoparticle addition on the wettability, microstructure and mechanical properties of In-45.6Sn-5Bi low temperature solder;Journal of Materials Science;2024-08

2. Design of Ni-rGO reinforced Sn2.5Ag0.7Cu0.1Ce composite solder based on micro-alloying and composite principles: Microstructure and properties;Journal of Materials Research and Technology;2024-07

3. Urchin-like multiscale structured fluorinated hydroxyapatite as versatile filler for caries restoration dental resin composites;Bioactive Materials;2024-05

4. Strength-enhanced Sn–In low-temperature alloy with surface-modified ZrO2 nanoparticle addition;Journal of Materials Science: Materials in Electronics;2023-11

5. Efficient fluorescent vapour sensing induced by ZnO buffer;Dyes and Pigments;2023-10