The thermal expansion behaviour of SiCp/Al–20Si composites solidified under high pressures-Reference-Cited by-同舟云学术

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The thermal expansion behaviour of SiCp/Al–20Si composites solidified under high pressures

Published:2015-01 Issue: Volume:65 Page:387-394
ISSN:0261-3069
Container-title:Materials & Design (1980-2015)
language:en
Short-container-title:Materials & Design (1980-2015)

Author:

Wei Zunjie,Ma Pan,Wang Hongwei,Zou Chunming,Scudino Sergio,Song Kaikai,Prashanth Konda G.,Jiang Wei,Eckert Jürgen

Funder

National Natural Science Foundation of China

Publisher

Elsevier BV

Subject

Applied Mathematics,General Mathematics

Reference44 articles.

1. Thermal expansion and dimensional stability of Al–Si matrix composite reinforced with high content SiC;Zhang;Mater Chem Phys,2003

2. Coefficients of thermal expansion of metal–matrix composites for electronic packaging;Shen;Metall Mater Trans A,1994

3. Thermal expansion behaviour of particulate metal–matrix composites;Elomari;Compos Sci Technol,1998

4. Synthesis of Al/SiC nanocomposite and evaluation of its mechanical properties using pulse echo overlap method;El-Daly;J Alloys Compd,2012

5. Production and properties of SiCp reinforced aluminium alloy composites;Sahin;Composites A,2003

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