Microstructure statistics–property relations of silver particle-based interconnects-Reference-Cited by-同舟云学术

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Microstructure statistics–property relations of silver particle-based interconnects

Published:2017-03 Issue: Volume:118 Page:304-313
ISSN:0264-1275
Container-title:Materials & Design
language:en
Short-container-title:Materials & Design

Author:

Gillman A.,Roelofs M.J.G.H.,Matouš K.,Kouznetsova V.G.,van der Sluis O.,van Maris M.P.F.H.L.

Funder

NANOTHERM project

Publisher

Elsevier BV

Subject

Mechanical Engineering,Mechanics of Materials,General Materials Science

Reference42 articles.

1. Advanced Materials for Thermal Management of Electronic Packaging;Tong,2011

2. Low-temperature sintering with nano-silver paste in die-attached interconnection;Wang;J. Electron. Mater.,2007

3. Are sintered silver joints ready for use as interconnect material in microelectronic packaging?;Siow;J. Electron. Mater.,2014

4. Thermally stable high temperature die attach solution;Paknejad;Mater. Des.,2016

5. A review of predictive nonlinear theories for multiscale modeling of heterogeneous materials;Matouš;J. Comput. Phys.,2017

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