Surface protrusion induced by inter-diffusion on Cu-Sn micro-pillars

Author:

Chen Yang,Dai Wenjie,Liu Yingxia,Chen Chih,Tu K.N.,Chen Guang

Funder

Ministry of Science and Technology, Taiwan

National Chiao Tung University

Ministry of Education

Publisher

Elsevier BV

Subject

Mechanical Engineering,Mechanics of Materials,General Materials Science

Reference43 articles.

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5. A.K. Ramanathan, S.S. Rangachar, J.-M. Hung, C.-Y. Lee, C.-X. Xue, S.-P. Huang, F.-K. Hsueh, C.-H. Shen, J.-M. Shieh, W.-K. Yeh, M.-S. Ho, H.T. Govindarajan, J. Sampson, M.-F. Chang, V. Narayanan, in: 2020 IEEE Int. Electron Devices Meet., IEEE, 2020, pp. 28.5.1-28.5.4.

Cited by 2 articles. 订阅此论文施引文献 订阅此论文施引文献,注册后可以免费订阅5篇论文的施引文献,订阅后可以查看论文全部施引文献

1. Lifetime prediction of copper pillar bumps based on fatigue crack propagation;Frontiers in Materials;2024-09-02

2. Void Growth and Intermetallic Bridging in Microscale Solder Interconnects Under Thermal Annealing;IEEE Transactions on Components, Packaging and Manufacturing Technology;2024-07

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