Effects of nano-Al2O3 particles on microstructure and mechanical properties of Sn3.5Ag0.5Cu composite solder ball grid array joints on Sn/Cu pads
Author:
Publisher
Elsevier BV
Subject
Applied Mathematics,General Mathematics
Reference33 articles.
1. Electromigration in the flip chip solder joint of Sn–8Zn–3Bi on copper pads;Lin;J Electron Mater,2007
2. Mechanical properties of Sn–0.7Cu/Si3N4 lead-free composite solder
3. Effects of nano-TiO2 additions on thermal analysis, microstructure and tensile properties of Sn3.5Ag0.25Cu solder;Tsao;Mater Des,2010
4. Effects of nano-Al2O3 additions on microstructure development and hardness of Sn3.5Ag0.5Cu solder;Tsao;Mater Des,2010
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