Application of shape memory alloy TiNi in low thermal expansion copper composites
Author:
Publisher
Elsevier BV
Subject
Applied Mathematics,General Mathematics
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4. Enhanced Interfacial Reliability and Mechanical Strength of CoSb3-Based Thermoelectric Joints with Rationally Designed Diffusion Barrier Materials of Ti-Based Alloys;ACS Applied Materials & Interfaces;2020-09-14
5. Fabrication of a Cu/TiNi Composite with High Air-Tightness and Low Thermal Expansion;JOM;2019-12-06
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