Novel aluminium-silicon alloys for electronics packaging-Reference-Cited by-同舟云学术

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Novel aluminium-silicon alloys for electronics packaging

Published:1997-10-01 Issue:5 Volume:6 Page:195-201
ISSN:0963-7346
Container-title:Engineering Science & Education Journal
language:en
Short-container-title:

Author:

Sangha S.P.S.,Botter E.,Azema M.,Jacobson D.M.,Junai A.A.,Ogilvy A.J.W.

Publisher

Institution of Engineering and Technology (IET)

Subject

Management of Technology and Innovation

Link

https://digital-library.theiet.org/content/journals/10.1049/esej_19970502?crawler=true&mimetype=application/pdf

Cited by 33 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

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5. Effect of sintering process on microstructure and properties of Al–Si alloy made by powder metallurgy for electronic packaging application;Materials Research Express;2023-06-01

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