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Ultrasonic powder consolidation of Sn/In nanosolder particles and their application to low temperature Cu-Cu joining

  • Published:2016-12 Issue: Volume:111 Page:631-639
  • ISSN:0264-1275
  • Container-title:Materials & Design
  • language:en
  • Short-container-title:Materials & Design

Author:

Shu Yang,Gheybi Hashemabad Somayeh,Ando Teiichi,Gu Zhiyong

Funder

National Science Foundation

Publisher

Elsevier BV

Subject

Mechanical Engineering,Mechanics of Materials,General Materials Science

Reference46 articles.

1. Microjoining and Nanojoining;Zhou,2008

2. Metal-joining methods;Bauer;Annu. Rev. Mater. Sci.,1976

3. Recent progress in micro and nano-joining;Zhou;J. Phys. Conf. Ser.,2009

4. Low temperature soldering;Mei,1997

5. Inert soldering with lead-free alloys: review and evaluation;Carsac,2001

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1. Consolidation of mechanically alloyed powders;Mechanical Alloying of Ferrous and Non-Ferrous Alloys;2024

2. Effect of isothermal aging on properties of In-48Sn and In-Sn-8Cu alloys;2022 IEEE 72nd Electronic Components and Technology Conference (ECTC);2022-05

3. Improvement of electrical and mechanical properties of In-48Sn solder bumps for flexible LED signage using Cu-Ag nanoparticles;Flexible and Printed Electronics;2021-09-01

4. Mechanical and microstructural enhancements of Ag microparticle-sintered joint by ultrasonic vibration;Journal of Materials Science: Materials in Electronics;2020-10-24

5. Characterization of Al Skeletal Structures Fabricated by Ultrasonic Powder Consolidation;Metallurgical and Materials Transactions A;2018-09-12
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