Author:
Ng Ruisheng,Yeo Zhiquan,Low Jonathan Sze Choong,Song Bin
Subject
Industrial and Manufacturing Engineering,Strategy and Management,General Environmental Science,Renewable Energy, Sustainability and the Environment
Reference39 articles.
1. Enabling low temperature copper bonding with an organic monolayer;Ang;Adv. Mat. Res.,2009
2. Eco-efficiency and ecodesign in electrical and electronic products;Aoe;J. Clean. Prod.,2007
3. PAS 2050: Specification for the Assessment of the Life Cycle Greenhouse Gas Emissions of Goods and Services;British Standard International,2011
4. Empirical analysis of the evaluation of regional ecology efficiency and influential factors in China-evidence from provincial data during 2000-2006;Chen;Chin. J. Manag. Sci.,2008
5. Investigations of strength of copper-bonded wafers with several quantitative and qualitative tests;Chen;J. Electron. Mater.,2006
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