1. Physics of Semiconductor Devices;Sze,2007
2. Cramming more components onto integrated circuits;Gordon E;Electronics,1965
3. Enabling sub-5nm CMOS technology scaling thinner and taller!;Ryckaert,2019
4. FEOL dry etch process challenges of ultimate FinFET scaling and next generation device architectures beyond N3;Tao,2020
5. Spin-on organic polymer dopants for silicon;Hoarfrost;J. Phys. Chem. Lett.,2013