Germanium surface wet-etch-reconditioning for porous lift-off and substrate reuse-Reference-Cited by-同舟云学术

Germanium surface wet-etch-reconditioning for porous lift-off and substrate reuse

Published:2023-12 Issue: Volume:168 Page:107851
ISSN:1369-8001
Container-title:Materials Science in Semiconductor Processing
language:en
Short-container-title:Materials Science in Semiconductor Processing

Author:

Chapotot Alexandre,Ilahi Bouraoui,Arias-Zapata Javier,Hanuš Tadeáš,Ayari Ahmed,Hamon Gwenaëlle,Cho Jinyoun,Dessein Kristof,Darnon Maxime,Boucherif Abderraouf

Publisher

Elsevier BV

Subject

Mechanical Engineering,Mechanics of Materials,Condensed Matter Physics,General Materials Science

Reference45 articles.

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