Alternative voltage-contrast inspection for pMOS leakage due to adjacent nMOS contact-to-poly misalignment-Reference-Cited by-同舟云学术

Alternative voltage-contrast inspection for pMOS leakage due to adjacent nMOS contact-to-poly misalignment

Published:2013-12 Issue:6 Volume:16 Page:1873-1878
ISSN:1369-8001
Container-title:Materials Science in Semiconductor Processing
language:en
Short-container-title:Materials Science in Semiconductor Processing

Author:

Chen Hunglin,Fan Rongwei,Lou Hsiaochi,Huang Yiping

Publisher

Elsevier BV

Subject

Mechanical Engineering,Mechanics of Materials,Condensed Matter Physics,General Materials Science

Reference9 articles.

1. Application of the SEMSpec electron-beam inspection system to in-process defect detection on semiconductor wafers

2. H. Liao, Y. Chen, G. Lee, Y. Shih, H. Lue, T. Luoh, L. Yang, K. Hsieh, T. Yang, K.C. Chen, R. Liu, C.Y. Lu, in: Proceedings of the 2012 e-Manufacturing & Design Collaboration Symposium, IEEE, 2012, 1–2.

3. O.D. Patterson, J. Lee, C. Lei, D. Salvador, in: Proceedings of the 23rd Annual Advanced Semiconductor Manufacturing Conference, IEEE, 2012, pp. 383–387.

4. C. Boye, T. Standeart, F. Wang, S.C. Lei, S.-T. Chen, J. Jau, D. Tomlison, in: Proceedings of the 23rd Annual Advanced Semiconductor Manufacturing Conference, IEEE, 2012, pp. 371–374.

Cited by 5 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Nondestructive Detection of Buried and Latent Defects by Negative Mode E-Beam Inspection;IEEE Transactions on Semiconductor Manufacturing;2022-08

2. Activation and Detection of Buried Defects by Negative Mode E-Beam Inspection;2021 32nd Annual SEMI Advanced Semiconductor Manufacturing Conference (ASMC);2021-05-10

3. The Inspection Solutions of 3Bar Structure Cu Void in BEOL Advanced Semiconductor Process;2020 China Semiconductor Technology International Conference (CSTIC);2020-06-26

4. Investigation of Tungsten Rich Residue Defects Induced by Electron Beam Inspection post Contact Tungsten Chemical and Mechanical Polish;2019 China Semiconductor Technology International Conference (CSTIC);2019-03

5. Mechanism and detection of poly gate leakage with nonvisual defects by voltage contrast inspection;Materials Science in Semiconductor Processing;2016-12