Subject
Mechanical Engineering,Mechanics of Materials,Condensed Matter Physics,General Materials Science
Reference45 articles.
1. Novel fabrication for vertically stacked inverted triangular and diamond-shaped silicon nanowires on (100) single crystal silicon wafer [J];He;J. Micromech. Microeng.,2020
2. Finite element simulation and experimental research on microcutting mechanism of single crystal silicon [J];Liu;Int. J. Adv. Manuf. Technol.,2020
3. Grinding of silicon wafers: a review from historical perspectives [J];Pei;Int. J. Mach. Tool Manufact.,2008
4. Formation of subsurface cracks in silicon wafers by grinding [J];Yin;Nanotech. Prec. Eng.,2018
5. Prediction of subsurface damage depth in rotary ultrasonic machining of glass BK7 with probability statistics [J];Yv;Int. J. Adv. Manuf. Technol.,2020
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