Automatic inspection in photoresist development processing with a partial area-imaging device-Reference-Cited by-同舟云学术

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Automatic inspection in photoresist development processing with a partial area-imaging device

Published:2007-12 Issue:6 Volume:10 Page:227-234
ISSN:1369-8001
Container-title:Materials Science in Semiconductor Processing
language:en
Short-container-title:Materials Science in Semiconductor Processing

Author:

Lin Chern-Sheng,Chan Shi-Xiang,Lay Yun-Long,Chen Shiaw-Wu,Chang Hsing-Cheng

Publisher

Elsevier BV

Subject

Mechanical Engineering,Mechanics of Materials,Condensed Matter Physics,General Materials Science

Reference7 articles.

1. Fuzzy analysis of the linear eqivalent for fabricating a hoe in photoresist;Chang;Jpn J Appl Phys,1995

2. Ultrasonic sensor for photoresist process monitoring;Morton;IEEE Trans Semicond Manuf,1999

3. Dynamical mapping and end-point detection of photoresist development by using plastic-fiber-bundle probe array;Lin;IEEE Trans Instrum Meas,1999

4. Dichromated gelatin hologram using digital image processing technology to optimise processing;Lin;Imaging Sci J,2000

5. An efficient three-step search algorithm for block motion estimation;Jing;IEEE Trans Multimedia,2004

Cited by 1 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Automatic inspection and strategy for surface defects in the PI coating process of TFT‐LCD panels;Assembly Automation;2011-08-02

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