Author:
Maurya Muni Raj,Toutam Vijaykumar,Singh Preetam,Bathula Sivaiah
Subject
Mechanical Engineering,Mechanics of Materials,Condensed Matter Physics,General Materials Science
Reference22 articles.
1. Surface micromachining for microelectro-mechanical systems;Bustillo;Proc. IEEE,1998
2. Anisotropic etching of silicon;Bean;IEEE Trans. Electron Devices,1978
3. Fabrication of microstructures with high aspect ratios and great structural heights by synchrotron radiation lithography, galvanoforming, and plastic moulding (LIGA process);Becker;Microelectron. Eng.,1986
4. F. Laermer, A. Schilp, Method of anisotropically etching silicon, U. S. Patent No. 5501893 (3, 26, 1996). https://patentimages.storage.googleapis.com/69/2d/c4/af6ae016bc71da/US5501893.pdf.
5. Micromachining of buried micro channels in silicon;Boer;J. Microelectromech. Syst.,2000
Cited by
4 articles.
订阅此论文施引文献
订阅此论文施引文献,注册后可以免费订阅5篇论文的施引文献,订阅后可以查看论文全部施引文献