On the nature and removal of saw marks on diamond wire sawn multicrystalline silicon wafers-Reference-Cited by-同舟云学术

On the nature and removal of saw marks on diamond wire sawn multicrystalline silicon wafers

Published:2014-11 Issue: Volume:27 Page:220-227
ISSN:1369-8001
Container-title:Materials Science in Semiconductor Processing
language:en
Short-container-title:Materials Science in Semiconductor Processing

Author:

Chen Wenhao^ORCID,Liu Xiaomei,Li Miao,Yin Chuanqiang,Zhou Lang

Publisher

Elsevier BV

Subject

Mechanical Engineering,Mechanics of Materials,Condensed Matter Physics,General Materials Science

Reference16 articles.

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2. Characterization of polycrystalline silicon wafers for solar cells sliced with novel fixed-abrasive wire

3. A. Holt, A. Thogersen, C. Rohr et al., in: Proceedings of the Photovoltaic Specialists Conference (PVSC), 2010 35th IEEE. Honolulu, HI, USA, 2010, pp. 003501–003504.

4. E. Cai, B. Tang, W. Fahrner, L. Zhou, in: Proceedings of the 26th European Photovoltaic Solar Energy Conference and Exhibition. Hamburg, Germany, 2011, pp. 1884–1886.

5. M. Radet, P. Jaffrennou, N. Habka, C. Takchi, E. Abric, J. Penaud, B. Lombardet, in: Proceedings of the 27th European Photovoltaic Solar Energy Conference and Exhibition. Frankfurt, Germany, September 2012, pp. 794–797.

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