Atomic layer chemical vapour deposition of copper
Author:
Publisher
Elsevier BV
Subject
Mechanical Engineering,Mechanics of Materials,Condensed Matter Physics,General Materials Science
Reference11 articles.
1. Effect of texture and grain structure on electromigration in Al-0.5%Cu thin films
2. Linewidth and underlayer influence on texture in submicrometer-wide Al and AlCu lines
3. Texture in multilayer metallization structures
4. An atomistic simulator for thin film deposition in three dimensions
5. Local crystallographic texture and voiding in passivated copper interconnects
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