Study on the effects of pressure and material characterization in thin film and TSV fabricated by supercritical carbon dioxide electrolyte-Reference-Cited by-同舟云学术

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Study on the effects of pressure and material characterization in thin film and TSV fabricated by supercritical carbon dioxide electrolyte

Published:2016-12 Issue: Volume:56 Page:5-13
ISSN:1369-8001
Container-title:Materials Science in Semiconductor Processing
language:en
Short-container-title:Materials Science in Semiconductor Processing

Author:

Chuang Ho-Chiao,Teng Yu-Chieh,Sanchez Jorge

Funder

Ministry of Science and Technology of Taiwan

Publisher

Elsevier BV

Subject

Mechanical Engineering,Mechanics of Materials,Condensed Matter Physics,General Materials Science

Reference10 articles.

1. Cramming more components onto integrated circuits;Moore;Electronics,1965

2. The development of an atom chip with through silicon vias for an ultra-high-vacuum cell;Chuang;J. Micromech. Microeng.,2013

3. The fabrication of a double-layer atom chip with through silicon vias for an ultra-high-vacuum cell;Chuang;J. Micromech. Microeng.,2014

4. Critical phenomena: 150 years since Cagnaird de la Tour;Berche;J. Phys. Stud.,2009

5. Fabrication of high aspect ratio copper nanowires using supercritical CO2 fluids electroplating technique in AAO template;Chuang;Mater. Sci. Semicond. Process.,2016

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4. The use of surfactants and supercritical CO2 assisted processes in the electroless nickel plating of printed circuit board with blind via;Materials Chemistry and Physics;2020-02

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