The fabrication of a double-layer atom chip with through silicon vias for an ultra-high-vacuum cell-Reference-Cited by-同舟云学术

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The fabrication of a double-layer atom chip with through silicon vias for an ultra-high-vacuum cell

Published:2014-03-13 Issue:4 Volume:24 Page:045013
ISSN:0960-1317
Container-title:Journal of Micromechanics and Microengineering
language:
Short-container-title:J. Micromech. Microeng.

Author:

Chuang Ho-Chiao,Lin Yun-Siang,Lin Yu-Hsin,Huang Chi-Sheng

Publisher

IOP Publishing

Subject

Electrical and Electronic Engineering,Mechanical Engineering,Mechanics of Materials,Electronic, Optical and Magnetic Materials

Link

http://stacks.iop.org/0960-1317/24/i=4/a=045013/pdf

Reference10 articles.

1. Bose-Einstein Condensation in a Surface Microtrap

2. Multilayer atom chips for versatile atom micromanipulation

3. Multi-layer atom chips for atom tunneling experiments near the chip surface

4. Atom-chip Bose-Einstein condensation in a portable vacuum cell

Cited by 7 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Review of Atom Chips for Absolute Gravity Sensors;Sensors;2023-05-26

2. Fundamental principles, key enabling technologies, and research progress of atom chips;Acta Physica Sinica;2021

3. Study on the effects of pressure and material characterization in thin film and TSV fabricated by supercritical carbon dioxide electrolyte;Materials Science in Semiconductor Processing;2016-12

4. Fifteen years of cold matter on the atom chip: promise, realizations, and prospects;Journal of Modern Optics;2016-05-16

5. Laser drilling of via micro-holes in single-crystal semiconductor substrates using a 1070nm fibre laser with millisecond pulse widths;SPIE Proceedings;2015-07-01

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