Optimal design toward enhancement of thermomechanical reliability of polyimide layers in a flip-chip-on-lead-frame dual flat no-leads package with copper pillar bumps-Reference-Cited by-同舟云学术

Optimal design toward enhancement of thermomechanical reliability of polyimide layers in a flip-chip-on-lead-frame dual flat no-leads package with copper pillar bumps

Published:2013-06 Issue:3 Volume:16 Page:933-939
ISSN:1369-8001
Container-title:Materials Science in Semiconductor Processing
language:en
Short-container-title:Materials Science in Semiconductor Processing

Author:

Ning Wenguo,Zhu Chunsheng,Li Heng,Xu Gaowei,Luo Le,Guo Hongyan,Jing Fei

Publisher

Elsevier BV

Subject

Mechanical Engineering,Mechanics of Materials,Condensed Matter Physics,General Materials Science

Reference19 articles.

1. Pb-free solders for flip-chip interconnects

2. Influence of interfacial intermetallic compound on fracture behavior of solder joints

3. Thermomechanical fatigue behavior of Sn-Ag solder joints

4. Model for BGA and CSP Reliability in Automotive Underhood Applications

5. A constitutive model for creep of lead-free solders undergoing strain-enhanced microstructural coarsening: A first report

Cited by 6 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Electrical and mechanical reliability and failure mechanism analysis of electrically conductive adhesives;Microelectronics Reliability;2023-12

2. Enhanced Cu pillar design to reduce thermomechanical stress induced during flip chip assembly;Microelectronics Reliability;2018-08

3. A Methodology to Integrate Thermo-Mechanical Reliability Predictions into Co-design of Flip-Chip-On-Lead Devices;2018 IEEE 68th Electronic Components and Technology Conference (ECTC);2018-05

4. Experimental identification of thermal induced warpage in polymer–metal composite films;Microelectronics Reliability;2016-07

5. An investigation of the reliability of solderable ICA with low-melting-point alloy (LMPA) filler;Microelectronics Reliability;2014-12