Representative volume element analysis for wafer-level warpage using Finite Element methods-Reference-Cited by-同舟云学术

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Representative volume element analysis for wafer-level warpage using Finite Element methods

Published:2019-03 Issue: Volume:91 Page:392-398
ISSN:1369-8001
Container-title:Materials Science in Semiconductor Processing
language:en
Short-container-title:Materials Science in Semiconductor Processing

Author:

Baek Jong Won,Yang Woo Seok,Hur Min Jae,Yun Jin Chul,Park Seong Jin

Funder

SK Hynix

Publisher

Elsevier BV

Subject

Mechanical Engineering,Mechanics of Materials,Condensed Matter Physics,General Materials Science

Reference27 articles.

1. A negative V/sub th/ cell architecture for highly scalable, excellently noise-immune, and highly reliable NAND flash memories

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1. A review on warpage measurement metrologies for advanced electronic packaging;Microelectronics Reliability;2024-09

2. Multi-Step Mechanical and Thermal Homogenization for the Warpage Estimation of Silicon Wafers;Micromachines;2024-03-18

3. A comprehensive study on the effect of molecular chain flexibility on the low-temperature curing ability of polyimides;Journal of Materials Chemistry C;2024

4. Exploring the Impact of Blend and Graft of Quinoline Derivative in Low‐Temperature Curable Polyimides;Macromolecular Rapid Communications;2023-08-31

5. Tensile responses of polycrystalline Mo via molecular dynamics simulation: Grain size and temperature effects;Materials Chemistry and Physics;2023-02

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