Study of the influence of additives on electroless copper deposition by gravimetric and microdensitometric techniques
Author:
Publisher
Elsevier BV
Subject
Materials Chemistry,Surfaces, Coatings and Films,Surfaces and Interfaces,Condensed Matter Physics,General Chemistry
Reference38 articles.
1. Interactions in Mixed Potential Systems
2. Kinetics of Electroless Copper Plating: IV . Empirical Rate Law for Baths
3. Mechanisms of Electroless Metal Plating: I . Application of the Mixed Potential Theory
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3. The influence of iridium, ruthenium and palladium on the electrochemical behaviour of Co-P and Ni-Co-P base amorphous alloys for water electrolysis in KOH aqueous solutions;International Journal of Hydrogen Energy;1995-02
4. The behaviour of NiCoP base amorphous alloys for water electrolysis in strongly alkaline solutions prepared through electroless deposition;International Journal of Hydrogen Energy;1992
5. Electroless copper deposition on a Pt polyfaceted single crystal;Journal of Electroanalytical Chemistry and Interfacial Electrochemistry;1990-03
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