Characterization of a colloidal Pd(II)-based catalyst dispersion for electroless metal deposition
Author:
Publisher
Elsevier BV
Subject
Colloid and Surface Chemistry
Reference37 articles.
1. Electroless Plating: Fundamentals and Applications;Colaruotolo,1990
2. Electroless Ni as a Refractory Ohmic Contact for n ‐ InP
3. Low Resistance Ohmic Contacts onto n ‐ InP by Palladium Electroless Bath Deposition
4. Use of Au-In-Pd and Pd-In Electroless Deposits for Ohmic Contacts on n-GaAs
Cited by 61 articles. 订阅此论文施引文献 订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献
1. Utilizing Hydrazine and Hydrogen as Reducing Agents to Control the Nanoscale Surface Morphology of the Palladium Thin Films;physica status solidi (a);2023-08-21
2. Electroless Plating of Ru Using Hydrazine Hydrate as a Reducing Agent;Journal of Electronic Materials;2023-07-26
3. Barrier/seed system for electroless metallization on complex surfaces using (aminomethylaminoethyl)phenethyltrimethoxysilane self-assembled films;Journal of Vacuum Science & Technology B;2023-07-01
4. Microstructure characterization and formation mechanism of colloid palladium for activation treatment on the surface of PPTA fibers;Applied Surface Science;2020-06
5. An investigation on electroless nickel coating on yttria stabilized zirconia nanoparticles via single step surface activation methods;Thin Solid Films;2019-01
1.学者识别学者识别
2.学术分析学术分析
3.人才评估人才评估
"同舟云学术"是以全球学者为主线，采集、加工和组织学术论文而形成的新型学术文献查询和分析系统，可以对全球学者进行文献检索和人才价值评估。用户可以通过关注某些学科领域的顶尖人物而持续追踪该领域的学科进展和研究前沿。经过近期的数据扩容，当前同舟云学术共收录了国内外主流学术期刊6万余种，收集的期刊论文及会议论文总量共计约1.5亿篇，并以每天添加12000余篇中外论文的速度递增。我们也可以为用户提供个性化、定制化的学者数据。欢迎来电咨询！咨询电话：010-8811{复制后删除}0370
www.globalauthorid.com
TOP
Copyright © 2019-2024 北京同舟云网络信息技术有限公司 京公网安备11010802033243号 京ICP备18003416号-3