Topology optimization of vapor chamber internal structures consisting of evaporator and condenser-Reference-Cited by-同舟云学术

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Topology optimization of vapor chamber internal structures consisting of evaporator and condenser

Published:2022-07 Issue: Volume:107 Page:233-255
ISSN:0307-904X
Container-title:Applied Mathematical Modelling
language:en
Short-container-title:Applied Mathematical Modelling

Author:

Li Baotong,Chen Hao,Xu Junhao,Yin Xinin,Hong Jun

Funder

National Natural Science Foundation of China

Fok Ying Tong Education Foundation

Publisher

Elsevier BV

Subject

Applied Mathematics,Modeling and Simulation

Reference65 articles.

1. Topology optimization, additive layer manufacturing, and experimental testing of an air-cooled heat sink;Dede;J. Mech. Des.,2015

2. Fundamentals of Microsystems Packaging;Tummala,2001

3. Topology optimization of conductive heat transfer problems using parametric L-systems;Ikonen;Struct. Multidiscip. Optim.,2018

4. Feasibility study of a vapor chamber with a hydrophobic evaporator substrate in high heat flux applications;Shaeri;Int. Commun. Heat Mass Transf.,2017

5. Working-fluid selection for minimized thermal resistance in ultra-thin vapor chambers;Patankar;Int. J. Heat Mass Transf.,2017

Cited by 2 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. A Detailed Thermal Resistance Network Analysis of FCBGA Package;Journal of Thermal Science;2023-10-28

2. Enhanced evaporation performance on a novel microstructured surface with vertical dimension gradient;International Journal of Heat and Mass Transfer;2022-12

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