Author:
Patankar Gaurav,Weibel Justin A.,Garimella Suresh V.
Funder
Intel Strategic Research Alliance
Subject
Fluid Flow and Transfer Processes,Mechanical Engineering,Condensed Matter Physics
Reference17 articles.
1. H. Aoki, N. Shioya, M. Ikeda, Y. Kimura, Development of ultra thin plate-type heat pipe with less than 1 mm thickness, in: 26th Annual IEEE Semiconductor Thermal Measurement and Management Symposium (SEMI-THERM), 2010, pp. 217–222.
2. A flat heat pipe architecture based on nanostructured titania;Ding;J. Microelectromech. Syst.,2010
3. Thin flexible thermal ground planes: fabrication and scaling characterization;Lewis;J. Microelectromech. Syst.,2015
4. The heat pipe;Dunn;Phys. Technol.,1973
5. Heat Pipes;Dunn,1994
Cited by
48 articles.
订阅此论文施引文献
订阅此论文施引文献,注册后可以免费订阅5篇论文的施引文献,订阅后可以查看论文全部施引文献