Fabrication of controlled expansion Al-Si composites by pressureless and spark plasma sintering

Author:

Haque Asraful,Shekhar S.,Narayana Murty S.V.S.,Ramkumar J.,Kar K.ORCID,Mondal K.

Publisher

Elsevier BV

Subject

Mechanics of Materials,General Chemical Engineering

Reference37 articles.

1. Microstructure and properties of SiCp/Al electronic packaging shell produced by liquid-solid separation;Guo;Trans. Nonferrous Met. Soc. China.,2014

2. Microstructure characterization and thermal properties of hypereutectic Si-Al alloy for electronic packaging applications;Yu;Trans. Nonferrous Met. Soc. China,2012

3. Advances in Composite Materials for Thermal Management in;Zweben;JOM.,1998

4. Silicon-aluminium network composites fabricated by liquid metal infiltration;Chen;J. Mater. Sci.,1994

5. Thermal Conductivity for all the elements in the Periodic Table, (n.d.). http://periodictable.com/Properties/A/ThermalConductivity.an.html (accessed May 16, 2018).

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