Author:
YU Kun,LI Shao-jun,CHEN Li-san,ZHAO Wei-shang,LI Peng-fei
Subject
Materials Chemistry,Metals and Alloys,Geotechnical Engineering and Engineering Geology,Condensed Matter Physics
Reference15 articles.
1. Electronic materials and processes handbook [M];HARPER,2004
2. Research states and development of high silicon aluminum alloy for light weight electronic package materials [J];GAN;Materials Review,2004
3. Research on high performance navel electronic packaging materials of Si-based aluminum [J];LIN;Materials Review,2006
4. Microstructural characterisation of spray formed Si-30Al for thermal management applications [J];HOGG;Scripta Mater,2006
5. Microstructure, thermo-physical and mechanical properties of spray-deposited Si-30Al alloy for electronic packaging application [J];WANG;Materials Characterization,2008
Cited by
32 articles.
订阅此论文施引文献
订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献