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Microstructure, thermo-physical and mechanical properties of spray-deposited Si–30Al alloy for electronic packaging application

  • Published:2008-10 Issue:10 Volume:59 Page:1455-1457
  • ISSN:1044-5803
  • Container-title:Materials Characterization
  • language:en
  • Short-container-title:Materials Characterization

Author:

Wang Feng,Xiong Baiqing,Zhang Yongan,Zhu Baohong,Liu Hongwei,Wei Yanguang

Publisher

Elsevier BV

Subject

Mechanical Engineering,Mechanics of Materials,Condensed Matter Physics,General Materials Science

Reference8 articles.

1. Spray-formed silicon–aluminum alloy;Jacobson;Adv Mater Process,2000

2. Powder metallurgy processing of thermal management materials for microelectronic applications;German;Int J Powder Metall,1994

3. Microstructural characterization of spray formed Si–30Al for thermal management applications;Hogg;Scr Mater,2006

4. Properties of high reinforcement-content aluminum matrix composite for electronic packages;Gaohui;J Mater Sci,2003

5. Novel low expansion packages for electronics;Jacobson;GEC J Technol,1997
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