Optimization of influent factors on nucleation process of copper in solutions containing thiourea using an experimental design
Author:
Publisher
Elsevier BV
Subject
Electrochemistry,General Chemical Engineering
Reference27 articles.
1. Electrochemical Deposition of Copper on a Gold Electrode in Sulfuric Acid: Resolution of the Interfacial Structure
2. Copper Deposition in the Presence of Surface‐Confined Additives
3. Importance of Surface Preparation in Electrochemical Investigations of the Copper System in Dilute Copper Sulfate Solutions
4. Influence of thiourea on the nucleation of copper from acid sulphate solutions
5. Galvanostatic studies of the nucleation and growth kinetics of copper in the presence of surfactants
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5. Investigations on thiourea content in ternary Sn–Ag–Cu bath using electrochemical studies;Journal of Applied Electrochemistry;2011-12-02
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