Effect of various hydrocolloids on the physical and fermentation properties of dough
Author:
Funder
National Natural Science Foundation of China
BTBU
Publisher
Elsevier BV
Subject
General Medicine,Food Science,Analytical Chemistry
Reference39 articles.
1. Microstructural studies of gluten and a hypothesis on dough formation;Amend;Food Structure,1991
2. Effect of modified whey protein concentrates on empirical and fundamental dynamic mechanical properties of frozen dough;Asghar;Food Hydrocolloids,2009
3. Use of hydrocolloids as bread improvers in interrupted baking process with frozen storage;Bárcenas;Food Hydrocolloids,2004
4. Influence of different hydrocolloids on major wheat dough components (gluten and starch);Bárcenas;Journal of Food Engineering,2009
5. Pasting, paste, and gel properties of starch-hydrocolloid combinations;Bemiller;Carbohydrate Polymers,2011
Cited by 101 articles. 订阅此论文施引文献 订阅此论文施引文献,注册后可以免费订阅5篇论文的施引文献,订阅后可以查看论文全部施引文献
1. Improvement of the freezing resistance characteristics of yeast in dough starter;Food Chemistry;2024-11
2. Mitigating effect of fucoidan versus sodium alginate on quality degradation of frozen dough and final steamed bread;Food Chemistry: X;2024-10
3. Effect of highland barley treated with heat–moisture on interactions between gluten and starch granules in dough;International Journal of Biological Macromolecules;2024-08
4. Effect of cellulase and pentosanase with lactic acid bacteria to increase gluten formation and elasticity in whole-wheat dough sheets;LWT;2024-08
5. Review of formation mechanisms and quality regulation of chewiness in staple foods: Rice, noodles, potatoes and bread;Food Research International;2024-07
1.学者识别学者识别
2.学术分析学术分析
3.人才评估人才评估
"同舟云学术"是以全球学者为主线,采集、加工和组织学术论文而形成的新型学术文献查询和分析系统,可以对全球学者进行文献检索和人才价值评估。用户可以通过关注某些学科领域的顶尖人物而持续追踪该领域的学科进展和研究前沿。经过近期的数据扩容,当前同舟云学术共收录了国内外主流学术期刊6万余种,收集的期刊论文及会议论文总量共计约1.5亿篇,并以每天添加12000余篇中外论文的速度递增。我们也可以为用户提供个性化、定制化的学者数据。欢迎来电咨询!咨询电话:010-8811{复制后删除}0370
www.globalauthorid.com
TOP
Copyright © 2019-2024 北京同舟云网络信息技术有限公司 京公网安备11010802033243号 京ICP备18003416号-3