Robust design of microelectronic assemblies against mismatched thermal expansion-Reference-Cited by-同舟云学术

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Robust design of microelectronic assemblies against mismatched thermal expansion

Published:2015 Issue: Volume: Page:27-99
ISSN:
Container-title:Robust Design of Microelectronics Assemblies Against Mechanical Shock, Temperature and Moisture
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Author:

Wong E.-H.,Mai Y.-W.

Publisher

Elsevier

Reference20 articles.

1. Thermal stresses in a rectangular plate clamped along an edge;Aleck;ASME Journal of Applied Mechanics,1949

2. Thermal stresses in laminated beams;Chen;Journal of Thermal Stresses,1982

3. Thermal stresses in bolted joints;Chen;IBM Journal of Research and Development,1979

4. Stresses in cemented joints;Goland;ASME Journal of Applied Mechanics,1944

5. Improved analytical estimate of global CTE mismatch displacement in area-array solder joints;Heinrich;ASME Transactions, Journal of Electronic Packaging,1997

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