Atomic layer deposition of α-Al2O3 from trimethylaluminum and H2O: Effect of process parameters and plasma excitation on structure development-Reference-Cited by-同舟云学术

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Atomic layer deposition of α-Al2O3 from trimethylaluminum and H2O: Effect of process parameters and plasma excitation on structure development

Published:2023-05 Issue: Volume:609 Page:127148
ISSN:0022-0248
Container-title:Journal of Crystal Growth
language:en
Short-container-title:Journal of Crystal Growth

Author:

Aarik Lauri,Piller Carl-Thomas,Raud Jüri,Talviste Rasmus,Jõgi Indrek,Aarik Jaan

Funder

European Regional Development Fund

European Commission

Eesti Teadusagentuur

Publisher

Elsevier BV

Subject

Materials Chemistry,Inorganic Chemistry,Condensed Matter Physics

Reference47 articles.

1. Chemically stable atomic-layer-deposited Al2O3 films for processability;Broas;ACS Omega,2017

2. Effect of α-Al2O3 additive on the microstructure and properties of MAO coatings prepared on low carbon steel;Zhao;J. Mater. Res. Technol.,2020

3. Al alloy protection via ultra-thin ceramic coatings and different surface pretreatments;Merisalu;Surf. Coat. Technol.,2022

4. Effects of moisture-proof back passivation layers of Al2O3 and AlxTi1–xOy films on efficiency improvement and color modulation in transparent a-Si: H solar cells;Kim;ACS Appl. Mater. Interfaces,2021

5. Preparation of Cr2O3/Al2O3 bipolar oxides as hydrogen permeation barriers by selective oxide removal on SS and atomic layer deposition;Zhang;Int. J. Hydrogen Energy,2019

Cited by 3 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Fabrication of ZnO–Al2O3 inverse opals with atomic layer deposited Amorphous-Al2O3 for enhanced photocatalysis;Materials Science in Semiconductor Processing;2024-11

2. Study of Mid-Pressure Ar Radiofrequency Plasma Used in Plasma-Enhanced Atomic Layer Deposition of α-Al2O3;Processes;2024-03-20

3. Nucleation and Growth Study of Al₂O₃ Film Fabricated Through Atomic Layer Deposition on Pet Substrate;2024 Conference of Science and Technology for Integrated Circuits (CSTIC);2024-03-17

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