Role of Ti and W in the Ni-based ohmic contacts to n-type 4H-SiC

Author:

Ge NiannianORCID,Wan Caiping,Jin Zhi,Xu Hengyu

Publisher

Elsevier BV

Subject

Materials Chemistry,Inorganic Chemistry,Condensed Matter Physics

Reference35 articles.

1. Material science and device physics in SiC technology for high-voltage power devices;Kimoto;Jpn. J. Appl. Phys.,2015

2. Reliability of 4H-SiC (0001) MOS Gate Oxide by NO Post-Oxide-Annealing;Xu;Mater. Sci. Forum,2019

3. The Correlation between the Reduction of Interface State Density at the SiO2/SiC Interface and the NO Post-oxide-annealing Conditions;Xu;Mater. Sci. Forum,2019

4. Design and Characterization of High-Temperature ECL-Based Bipolar Integrated Circuits in 4H-SiC;Lanni;IEEE Trans. Electron Devices,2012

5. Demonstration of 4H-SiC Digital Integrated Circuits Above 800 °C;Neudeck;IEEE Electron Device Lett.,2017

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