Simulation of grain morphologies and competitive growth in weld pool of Ni–Cr alloy
Author:
Publisher
Elsevier BV
Subject
Materials Chemistry,Inorganic Chemistry,Condensed Matter Physics
Reference15 articles.
1. Characterization of the microstructure evolution in a nickel base superalloy during continuous cooling conditions
2. Microstructures and mechanical properties of friction stir welds of 60% Cu–40% Zn copper alloy
3. Modeling and real time mapping of phases during GTA welding of 1005 steel
4. Numerical simulation of equiaxed grain formation in weld solidification
5. Numerical simulation of columnar dendritic grain growth during weld solidification process
Cited by 32 articles. 订阅此论文施引文献 订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献
1. Thermal, Metallurgical and Mechanical Determinants of Laminar Nickel/Aluminum Dissimilar Alloys during Laser-material Interaction Part I: Nickel-based Superalloy;Journal of Physics: Conference Series;2022-10-01
2. Additive manufacturing of a Ni-20 wt%Cr binary alloy by laser powder bed fusion: Impact of the microstructure on the mechanical properties;Materials Science and Engineering: A;2022-02
3. Review on processing stability, weld defects, finite element analysis, and field assisted welding of ultra-high-power laser (≥ 10 kW) welding;International Journal of Hydromechatronics;2022
4. Microstructure and Solidification Cracking Analysis of Dissimilar Pulsed Laser Welded Hastelloy X to 347 Stainless Steel Using Phase-Field Models;Metallurgical and Materials Transactions B;2021-05-12
5. A novel 3D cellular automata-phase field model for computationally efficient dendrite evolution during bulk solidification;Computational Materials Science;2021-05
1.学者识别学者识别
2.学术分析学术分析
3.人才评估人才评估
"同舟云学术"是以全球学者为主线，采集、加工和组织学术论文而形成的新型学术文献查询和分析系统，可以对全球学者进行文献检索和人才价值评估。用户可以通过关注某些学科领域的顶尖人物而持续追踪该领域的学科进展和研究前沿。经过近期的数据扩容，当前同舟云学术共收录了国内外主流学术期刊6万余种，收集的期刊论文及会议论文总量共计约1.5亿篇，并以每天添加12000余篇中外论文的速度递增。我们也可以为用户提供个性化、定制化的学者数据。欢迎来电咨询！咨询电话：010-8811{复制后删除}0370
www.globalauthorid.com
TOP
Copyright © 2019-2024 北京同舟云网络信息技术有限公司 京公网安备11010802033243号 京ICP备18003416号-3