Development of high uniformity Al1-xScxN piezoelectric film stack dry etching process on 8-inch silicon wafers-Reference-Cited by-同舟云学术

Development of high uniformity Al1-xScxN piezoelectric film stack dry etching process on 8-inch silicon wafers

Published:2023-04 Issue: Volume:210 Page:111907
ISSN:0042-207X
Container-title:Vacuum
language:en
Short-container-title:Vacuum

Author:

Yan Jiahui^ORCID,Zhou Yongxin,Zhang Songsong

Funder

National Key Research and Development Program of China

Publisher

Elsevier BV

Subject

Surfaces, Coatings and Films,Condensed Matter Physics,Instrumentation

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