Measurement of electromigration-induced stress in aluminum alloy interconnection
Author:
Publisher
Elsevier BV
Subject
Surfaces, Coatings and Films,Condensed Matter Physics,Instrumentation
Reference7 articles.
1. Proceedings of second international workshop on stress-induced phenomena in metallization, Austin, TX, 1993;Marieb,1993
2. Proceedings of second international workshop on stress-induced phenomena in metallization, Austin, TX, 1993;Rathore,1993
3. Reliability design of current stress in LSI interconnects using the estimation of failure rate due to electromigration
4. Stress-induced and electromigration voiding in aluminum interconnects passivated with silicon nitride
5. Electromigration-induced stress in aluminum conductor lines measured by x-ray microdiffraction
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1. Residual Stresses of Cr-N Films Deposited by Arc Ion Plating Investigated Using Synchrotron Radiation;Materials Science Forum;2010-05
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