Cu films prepared by bipolar pulsed high power impulse magnetron sputtering-Reference-Cited by-同舟云学术

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Cu films prepared by bipolar pulsed high power impulse magnetron sputtering

Published:2018-04 Issue: Volume:150 Page:216-221
ISSN:0042-207X
Container-title:Vacuum
language:en
Short-container-title:Vacuum

Author:

Wu Baohua^ORCID,Haehnlein Ian,Shchelkanov Ivan,McLain Jake,Patel Dhruval,Uhlig Jan,Jurczyk Brian,Leng Yongxiang,Ruzic David N.

Funder

NSF center for Lasers and Plasma for Advanced Manufacturing under the I/UCRC program

Starfire Industries

China Scholarship Council

Publisher

Elsevier BV

Subject

Surfaces, Coatings and Films,Condensed Matter Physics,Instrumentation

Reference29 articles.

1. Internal stress and adhesion of Cu film/Si prepared by both MEVVA and IBAD;Yu;Surf. Coating. Technol.,2006

2. Adhesion studies of CVD copper metallization;Gandikota;Microelectron. Eng.,2000

3. Self-assembled monolayers on oxidized metals. 4. Superiorn-alkanethiol monolayers on copper;Ron;J. Phys. Chem. B,1998

4. Study of glass metallization and adhesion evaluation for TGV application Electronic Packaging Technology (ICEPT);Chen,2013

5. Properties of ultra-thin Cu films grown by high power pulsed magnetron sputtering;Solovyev;Thin Solid Films,2017

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