Facilitating strong interfacial bonding of immiscible Nb/Cu system using consumable Ti interlayer
Author:
Funder
Chongqing University of Technology
Chongqing Municipal Education Commission
Publisher
Elsevier BV
Subject
Surfaces, Coatings and Films,Condensed Matter Physics,Instrumentation
Reference21 articles.
1. Direct diffusion bonding of immiscible tungsten and copper at temperature close to copper's melting point;Zhang;Mater. Des.,2018
2. Binary Alloy Phase Diagrams;Massalski,1990
3. Thermodynamic mechanism for direct alloying of immiscible tungsten and copper at a critical temperature range;Zhang;J. Alloys Compd.,2019
4. Construction of metallurgical interface with high strength between immiscible Cu and Nb by direct bonding method;Pan;J. Alloys Compd.,2017
5. Femtosecond laser fabricated micro/nano interface structures towards enhanced bonding strength and heat transfer capability of W/Cu joining;Jiang;Mater. Des.,2017
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1. Effect of vacuum diffusion bonding on the mechanical and conductive properties of bonded bulk copper single crystals;Vacuum;2024-10
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3. Migrating behaviors of interfacial elements and oxide layers during diffusion bonding of 6063Al alloys using Zn interlayer in air;Journal of Materials Science & Technology;2023-08
4. The influence of Ti interlayer on the microstructure evolution and mechanical properties of CuW/Al composite;Vacuum;2023-08
5. On formation of intermetallic compounds at the Copper /Niobium-Titanium interface;Journal of Alloys and Compounds;2022-10
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