A percolative simulation of electromigration phenomena-Reference-Cited by-同舟云学术

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A percolative simulation of electromigration phenomena

Published:2001-03 Issue:1-4 Volume:55 Page:349-353
ISSN:0167-9317
Container-title:Microelectronic Engineering
language:en
Short-container-title:Microelectronic Engineering

Author:

Pennetta C.,Reggiani L.,Trefán Gy.,Fantini F.,DeMunari I.,Scorzoni A.

Publisher

Elsevier BV

Subject

Electrical and Electronic Engineering,Surfaces, Coatings and Films,Condensed Matter Physics,Atomic and Molecular Physics, and Optics,Electronic, Optical and Magnetic Materials

Reference5 articles.

1. Electromigration testing of integrated circuit interconnections

2. Electromigration: A review

3. Thermal effects on the electrical degradation of thin film resistors

4. A percolative approach to reliability of thin films

5. Measurement of the electrical properties of electromigration specimens

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