Author:
Uhlig M,Bertz A,Rennau M,Schulz S.E,Werner T,Gessner T
Subject
Electrical and Electronic Engineering,Surfaces, Coatings and Films,Condensed Matter Physics,Atomic and Molecular Physics, and Optics,Electronic, Optical and Magnetic Materials
Reference6 articles.
1. Speeding the transition to 0.18 μm;Peters;Semiconductor International,1998
2. The National Technology Roadmap for Semiconductors, Semiconductor Industry Association SIA, 1997, pp. 101–105.
3. S.E. Schulz, A. Bertz, R. Streiter, M. Uhlig, U. Weiss, T. Werner, T. Winkler, T. Gessner, Fluoropolymer and aerogel thin films as low k dielectrics in IC metallization, in: 1998 International Conference on Solid State Devices and Materials, Hiroshima, Japan, Sept. 7–10 1998; Ext. Abstract Vol., The Japan Society of Applied Physics, p. 264.
4. P. Xu, J. Huang, K. Singh, S. Robles, W.F. Yau, Plasma enhanced CVD amorphous fluorinated carbon films as low k dielectrics, DUMIC Conf., Feb. 16–17, 1998, Palo Alto, CA.
5. Fluorinated amorphous carbon as a low-dielectric-constant interlayer dielectric;Endo;MRS Bull.,1997
Cited by
19 articles.
订阅此论文施引文献
订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献