Development of an electroplating solution for codepositing Au–Sn alloys-Reference-Cited by-同舟云学术

Development of an electroplating solution for codepositing Au–Sn alloys

Published:1999-11 Issue:2 Volume:65 Page:111-122
ISSN:0921-5107
Container-title:Materials Science and Engineering: B
language:en
Short-container-title:Materials Science and Engineering: B

Author:

Sun W,Ivey D.G

Publisher

Elsevier BV

Subject

Mechanical Engineering,Mechanics of Materials,Condensed Matter Physics,General Materials Science

Reference31 articles.

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2. C. Kallmayer, D. Lin, H. Oppermann, J. Kloeser, S. Weib, E. Zakel, H. Reichl, Proceedings of the 10th European Microelectronics Conference, 1995, pp. 440.

3. Flip-Chip Technologies (ch. 15);Zakel,1995

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